PSI and PiBond Collaborate to Advance Semiconductor Lithography

The Paul Scherrer Institute PSI and PiBond are collaborating on the commercialization of advanced EUV semiconductor lithography products. EUV lithography is crucial for fabricating faster and more energy-efficient semiconductor chips, driving advancements in artificial intelligence.

PiBond is focusing on overcoming limitations in lithographic materials. PiBond has established a subsidiary in Switzerland to deepen collaboration with PSI and develop advanced lithography technologies.

Thomas Gädda from PiBond highlights the importance of the collaboration with PSI in advancing material and process development for next-generation semiconductor devices. The agreement strengthens PiBond's development capabilities and emphasizes successful technology transfer from research to industry.

Pasi Leinonen from PiBond stresses the company's commitment to innovation and technological advancements. Dr.

Yasin Ekinci from PSI is involved in leading the X-ray Nanoscience and Technology Laboratory. For media inquiries, Pasi Leinonen can be contacted at PiBond for more information..

(Quelle:Swiss Federal Council modified with ChatGPT)

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PSI PiBond Collaborate Advance Semiconductor Lithography

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