Electronic components are becoming smaller, more complex and more powerful – this calls for new solutions for joining them. An Empa team is developing nanostructured joining materials for the next generation of microelectronics and other demanding applications.2023-02-02 12:45:16
The increasing miniaturization and complexity of electronic components requires new solutions for joining them. An Empa team is developing nanostructured joining materials for the next generation of microelectronics.
Industry is already using silver nanopastes, i.e. joining materials consisting of silver nanoparticles.
Nanopastes with multiple components are being developed to optimize the properties of the joining compound and to open up new areas of application. Copper and nickel nanopastes are being investigated as they are less expensive than silver and exhibit interesting electrical and thermal properties.
Reactive foils are used as a local source of heat for reactive joining. Nanomultilayer systems offer the possibility of carrying out joining processes much faster and at significantly lower temperatures than with conventional brazing techniques.
Empa is one of the main players in nanojoining, a new scientific discipline. Joining techniques for nano-objects and high-performance joining processes that utilize nano-effects fall under this discipline..
(Quelle:Swiss Federal Council modified with ChatGPT)
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